 |
||
 |
 |
|
 |
||
Via and/or Wrapped Connections
In any circuit medium, vias are a great advantage to the designer. However, the tendency to overpopulate ground areas is a temptation obvious in many designs. Critical to hard substrate manufacturing is the careful consideration of via quantity and location. While aiding the performance of the design, poorly placed vias can degrade yield due to reduced durability of the substrate in manufacturing. DITF CAD services can optimize your design for your electrical need balanced with manufacturing enhancements. One method of enhancing a design which has developed into a significant advantage to designers is the use of the filled via. DITF uses the industry preferred solid Cu and Au process as opposed to the less-desirable glass/metal paste method used by other companies.
Plated Through Vs Filled Vias
| Feature | DC Resistance |
Inductance | RF Resistance |
1 mΩ |
78pH |
4 mΩ |
|
4 mΩ |
81pH |
14 mΩ |
Plated Through Via Vs Substrate Thickness
| Substrate Thickness |
Substrate Material |
Minimum Diameter |
Via Spacing | |
| Cntr.-Cntr. | Cntr.-Edge | |||
.010" |
Al2O3,BeO,AIN |
.010" |
.030" |
.025" |
.015" |
Al2O3,BeO,AIN |
.015" |
.035" |
.027" |
.020" |
Al2O3,BeO,AIN |
.020" |
.040" |
.030" |
.025" |
Al2O3,BeO,AIN |
.025" |
.045" |
.033" |
.040" |
Al2O3,BeO,AIN |
.040" |
.060" |
.040" |
.050" |
Al2O3,BeO,AIN |
.050" |
.070" |
.045" |
.005" |
Al2O3,BeO |
.005" |
.027" |
.023" |
Filled Via Vs Substrate Thickness
| Substrate Thickness |
Substrate Material |
Ideal Via Diameter |
Via Spacing | ||
| Cntr.-Cntr. | Cntr.-Edge | Fill | |||
.010" |
Al2O3,BeO |
.008" |
.028" |
.020" |
Cu,Au |
.015" |
Al2O3,BeO |
.012" |
.034" |
.020" |
Cu,Au |
.020" |
Al2O3,BeO,AIN |
.016" |
.032" |
.020" |
Cu,Au |
.025" |
Al2O3,BeO,AIN |
.020" |
.040" |
.025" |
Cu,Au |
Via Application Data
| Parameter | Valve |
| Filled Via Conductivity
|
|
Copper 99.9% |
393 W/M°C |
Gold 99.9% |
300 W/M°C |
Filled Via Planarity |
+0/-.0003" |
Filled Via Aerospace Qualification Report