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Solder Masks
Various methods are available to provide the appropriate solder barrier, enhancing the ease of assembly of the design. Consult the factory for the optimum method for your design.
| Solder Barriers and Control | ||||
Parameter |
Material |
|||
TiW |
Polyimide |
NiOx |
Comments |
|
Thickness |
1000 Â |
160 - 320µ" |
*20 - 300µ" |
* Plated Nickel thickness |
Max. temperature |
350°C/60 sec |
425°C/60 sec |
*N/A |
* limited only by metallization scheme |
Min. gap width |
.002" |
.004" |
.001" |
|
Min. conductor overlap |
.002" |
.004" |
*N/A |
|
Min. feature width |
.002" |
.004" |
* |
* Width is equal to conductor width |
Distance to circuit edge |
.003" |
.003" |
*N/A |
* See metal feature to edge criteria |
Additive or Subtractive Process |
Additive |
Additive |
Subtractive |
|
Application side |
A side, B side or both |
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| Overall capability |
Good |
Better |
Best |
Based on user feedback |