Pre-deposited Solders

DITF offers pre-deposited and patterned AuSn solder. On designs with multiple solder hierarchy or multiple pre-form sites, this can be a cost effective way to eliminate pre-forms. Consult the factory for available thicknesses and other details for applications and design criteria.

Au/Sn Eutectic Material Properties
Parameter	Value	Units
Composition	80 Au / 20 Sn	Wt %
Melting Temeprature	284.0	°C
Density	14.5	g/cm³
Electric Conductivity	7.7	%IACS
Thermal Conductivity	57.0	W/mk
Temperature Coefficient of Expansion	16.0	m/mK
Resistivity	160.0	n ohm m
Modules of Elasticity	59.0	GPa
Tensile Strength	276.0	MPa

Integrated Au/Sn (80/20 wt %) Eutectic Solder
Feature	Value	Tolerance±	Comments
Thickness range	80 - 200 µ"	20 µ"	Most common thickness = 160 µ"
Minimum feature size	.005"	N/A
Solder pad pullback from Au metallization	.0015"	N/A	Eutectic pad is inboard of conductor
Au metallization pullback from substrate edge	.002"	N/A	Termination at edge is available, consult factory
Solder pad placement	N/A	.001"
Minumum substrate thickness	.005"	N/A

Note: The Au/Sn eutectic is a sputtered material (Au,80.4/ Sn,19.52 - Weight %, Typ); which provides superior flatness and thickness control. Typically, sputtered films can replace preforms of 2-3 times the thickness. Sizing of Au/Sn pads is critical and is developed from customer supplied information with respect to die size and tolerance .

Other solders are available on request, please contact either your sales representative or the factory for details.