Knowles Precision Devices acquires DITF

Knowles Precision Devices is pleased to announce our acquisition of DITF Interconnect Technology.

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Certified since March 2010
and upgraded to ISO 9001:2015 in 2018

ISO Cert




Gridlok© is a simple, yet highly effective backside metallization structure that provides increased surface area for both soldered and epoxy attachment processes. When standard attachment interfaces test at marginal values, Gridlok© will optimize device adhesion and pull and shear strengths in critical applications.


Gridlok© Enhanced Bonding Strength for Die Attach
1/10 Substrate Thickness, not <002"
X Dimension Grid Spacing C to C
1/10 Die X Dimension
Y Dimension Grid Spacing C to C
1/10 Die Y Dimension
Platform Height
.0002" - .002"

Note: The Gridlok© pattern is placed on top of the "B" side metal thickness required for the designed device performance. A metal pull back will be required for "B" side standard metal to facilitate die separation without metal burring.